Builders Carpet Inc. The area occupied by a focal plane array sensor hybrid during testing is much less than that occupied by a prior art sensor hybrid during testing because the sensor hybrid in accordance with the present invention is not yet mounted on its system board. Fergus Falls, MN Bus: www. Brock White Co. The polyester adhesive layer was dissolved from this film using chloroform. First, the hybrid is free of flying leads. Schmidt Industries, Inc. A high density interconnect HDI structure or system which has been developed by General Electric Company offers many advantages in the compact assembly of electronic systems. Replacement chips are then mounted on substrate in place of the faulty chip or chips and a new high density interconnect structure is formed thereover to create a repaired focal plane array sensor hybrid. The system 60 presents a substantial cooling load.
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Consequently, the fabrication process is substantially simpler. The present application is related to patent application Ser. The chip 30 may be, for example, InSb, HgCdTe or any other imager material, as may be appropriate to the purpose of the system.
One of the features of the flexible high density interconnect structure which makes this multi-hybrid test assembly feasible is the fact that the hybrid, once extracted from the test assembly, can then be mounted on an appropriate support structure. Assuming that the focal plane array sensor hybrid passes this zero degree field of view test, additional tests such as flood illumination combined with cell-to-cell uniformity determinations are performed as part of the acceptance test for such a focal plane array.
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|Third, although removal and reattachment of a wire bond is possible, it is not feasible for a significant number of wire bonds or in a production environment.
Michaud John W St. This, in turn, requires a large cooling system than would be required if a smaller dewar could be used. Werschay David Roosevelt Road St. Consequently, the fabrication process is substantially simpler. Another problem with this high density interconnect structure is the fact that it applies its dielectric layer over the entire system it is to interconnect and the polyimide and polyetherimide materials which serve as its dielectric material exhibit substantial absorbence of the infrared frequencies of interest in InSb and HdCdTe infrared sensing systems.
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Appropriate via holes are then drilled in the dielectric layer in alignment with all contact pads to which connection is to be made. At that time the individual focal plane array sensor hybrids which have passed a sufficient set of acceptance tests or conditions, are individually excised, separated or removed from the test assembly by cutting the high density interconnect structure to separate the focal plane array sensor hybrid from the remainder of the test assembly high density interconnect structure, including those portions of the test bus system which are not part of the focal plane array sensor hybrid.
The addition of dye greatly enhances the absorbance at nm. Eichelberger et al. Consequently, the fabrication process is substantially simpler.
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|A polyimide layer having a polyester adhesive layer disposed thereon was obtained from Sheldahl Corporation under their catalog number T The process of designing an interconnection pattern for interconnecting all of the chips and components of an electronic system on a single high density interconnect substrate normally takes somewhere between one week and five weeks.
A new high density interconnect structure is then formed on the test carrier to provide six new focal plane array sensor hybrids appropriately connected to test fixture contacts and the testing process is repeated.
Similarly, a single chip may in this sense contain a plurality of components in that one chip can contain a multiplexer, an amplifier and other subsystems, each of which may be considered a component of the system.
The absorbance of a similar sample without dye was also measured.
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In particular, the external configuration of the metal in the via hole takes on the shape of the via hole, rather than vice versa as would be the case if the metal in the via hole were formed first and the dielectric filled in around it. Dupont de Nemours which has application as a hot melt adhesive. The initial test performed at this temperature is the so-called "zero degree field of view" test in which external radiation is excluded from the system and the readout chips of a focal plane array sensor hybrid are exercised to read out every pixel of the focal plane array.
However, they are strong enough to be self-supporting across a gap in the dielectric layer ". Wafer level integration of focal plane arrays having a flexible conductive layer to provide an optical aperture for each pixel.
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|The focal plane array sensor hybrid recited in claim 10 wherein: said first chip is mounted in a cryogenic dewar.
This introduces a substantial cost since the printed circuit board itself is expensive as are each of the chips mounted thereon. This result demonstrates the feasibility of dye interdiffusion as a means of improving the absorbance characteristics of a polymeric film and hence, improving the film's laser drilling characteristics. It will be understood that a component may be considered to be a chip as such or may be viewed as a subsystem such as a readout system which may be embodied in a single chip or in a plurality of chips depending on its size and complexity and the size and complexity of the chips.
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While InSb and HgCdTe are suitable for infrared detection, they are not suitable for the formation of integrated circuits or other electronics suitable for processing of image information which is collected by suitably processed imagers.
Although not explicitly shown, the high density interconnect structure can have a rigid portion which connects a first readout chip to the focal plane array chip and a flexible portion which connects a second readout chip to the focal plane array chip.